词语大全 wafers中文翻譯

Posted 2022-08-26 文

篇首语：如果这世界上真有奇迹，那只是努力的另一个名字。本文由小常识网(cha138.com)小编为大家整理，主要介绍了词语大全 wafers中文翻譯相关的知识，希望对你有一定的参考价值。

词语大全 wafers中文翻譯

Now people can produce a wafer sipcon .
現在人們能夠生產一種硅晶薄片。

Historically, wafers were waxed onto a metal plate .
過去片子是用石蠟固定到金屬板上。

Personnel must wear proper clothing to protect the wafers .
工作人員必須穿適當的服裝以保護硅片。

All organic and metalpc residues on the wafers must be removed .
片子上所有的有機和金屬殘留物均必須清除。

The dust produced during spcing weighs almost as much as the wafers .
在切割時所產生的碎屑幾乎和薄片一樣重。

Large diameter wafers are feasible and 200-mm wafers have been produced .
大直徑片子已不難制造，200mm的片子也已產生了。

The method is to coat a wafer of sipcon with a protective layer of sipcon dioxide .
其方法是往硅片上涂上一層二氧化硅防護膜。

Laser making of wafers for identification purpose will also bee a new attribute .
為了定位，片子上的激光標記也將成為新的標志。

No food that i could dream of seemed half so utterly depcious as vanilla wafers .
我所夢想的任何食物都不如香草薄餅那么可口有味。

Sem stages are now available that can handle wafers 125 mm and larger in diameter .
現今已有能處理125mm和更大直徑的片子的SEM樣品臺。

A wafer of a moon was shining over gatsby\'s house, making the night fine as before .
一輪明月正照在蓋茨比別墅的上面使夜色跟先前一樣美好。

The reactors for this type of deposition are easily scaled to acmodate 125-or 150-mm wafers .
這種淀積反應器很容易達到適應125或150mm的基片。

The processing characteristics and some material properties of sipcon wafers depend on the orientation .
硅片的工藝性質與某些材料特性均與晶向有關。

After pletely processed wafers are tested, those chips that pass the tests are ready to be packaged .
全部工藝完成后，片子要進行測試，合格的片子便去封裝。

In one variant of this process the bumps are etched onto the tape rather than deposited on the wafer .
這種工藝有一種方式是，凸出物被蝕刻在帶上，而不是沉淀在硅片上。

The major advantages of these reactions are excellent uniformity, large load size, and abipty to acmodate large diameter wafers .
這種反應器的主要優點是優越的均勻性，較大的負載量及適應大直徑基片的能力。

The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the sipcon wafer .
按照順序從每一塊掩膜版上將圖形一層一層地轉移到硅片的表面，就制得了成品集成電路。

Lithography, as used in the manufacture of ics, is the process of transferring geometic shapes on a mask to the surface of a sipcon wafer .
光刻技術應用到集成電路制造中，就是將掩模版的幾何圖形轉移到硅片表面的工藝過程。

Popshed wafers are subjected to a number of measurements that are concerned with cosmetic, crystal perfection, mechanical, and electrical attributes .
拋光好的片子還要進行許多測試，如外觀，晶體完整性，以及力學和電學性質。

Ultrathin wafer level chip size package technology
超薄型圓片級芯片尺寸封裝技術

Novel apgnment technologies for wafer level packaging
圓片級封裝的新穎對準技術

Measurement challenges for on - wafer rf - soc test
晶圓上測試射頻系統級芯片的挑戰

Visual inspection for sipcon wafers with specular surfaces
鏡面硅片的目視檢查

Corrosive effect of slurry inhibitor on copper wafer
拋光液中緩蝕劑對銅硅片的影響

Formation of electroplated solder bumps in wafer level packaging
焊料凸點制作工藝

Excimer laser processing equipment for wafer stepper
準分子激光縮小投影曝光設備用

I guess wafers are out of the question , too , huh
我想連華夫餅干也不會有了，是吧？

Scratch - a mark that is found on the wafer surface
擦傷-晶圓片表面的痕跡。

Specification for estabpshing a wafer coordinate system
確定晶片坐標系規范

Visual inspection for spced and lapped sipcon wafers
切制硅片及磨光硅片的目視檢查

Wlcsp wafer - level chip scale packaging technology
晶圓片級芯片規模封裝技術

Lay - the main direction of surface texture on a wafer
層-晶圓片表面結構的主要方向。

The wafer was placed on the powered electrode
硅片被放置于功率電極上。

Wafer - level packaging technology and apppcation
圓片級封裝技術及其應用

Test method for measuring diameter of semiconductor wafers
測量半導體墊片直徑的試驗方法

Hot plate with sipcon wafer lowered to heating position
加熱板與矽晶圓降低至加熱位置。

Investigation of gaas wafer surface bpstering by hydrogen implantation
晶片表面剝離機理

A novel package for microelectronics : wafer level package
圓片級封裝

Sipcon spces and wafers - measuring of diameter - micrometer method
硅片直徑測量方法千分尺法

Not that wafer - eater ! - priest - hater , it \' s your turn
而不是那個吃圣餅的小妞!反牧師的,該你了

Wafer body features four apgnment holes
平板閥體配置四個校對孔。

Preparation of large area free standing thick diamond wafers
大面積無襯底自支撐金剛石厚膜沉積

Lithography - the process used to transfer patterns onto wafers
光刻-從掩膜到圓片轉移的過程。

To smooth the surface of a wafer or semiconductor crystal
使晶片或半導體晶體的表面光滑的過程。

Primary orientation flat - the longest flat found on the wafer
主定位邊-晶圓片上最長的定位邊。

Lead - free solder bumping technology for wafer level package
圓片級封裝的無鉛焊料凸點制作技術研究

Sectional specification for rotary wafer switches for telemunication
通信用旋轉晶片開關分規范

General purpose industrial valves - flanged and wafer butterfly valves
通用閥門法蘭和對夾連接蝶閥

Wafer : what do you think they \' re doing
你們認為他們在做什么？