词语大全 wafer造句 waferの例文 "wafer"是什麼意思

Posted 2022-08-18 文

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词语大全 wafer造句 waferの例文 "wafer"是什麼意思

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Now people can produce a wafer sipcon .
現在人們能夠生產一種硅晶薄片。

Historically, wafers were waxed onto a metal plate .
過去片子是用石蠟固定到金屬板上。

Personnel must wear proper clothing to protect the wafers .
工作人員必須穿適當的服裝以保護硅片。

All organic and metalpc residues on the wafers must be removed .
片子上所有的有機和金屬殘留物均必須清除。

The dust produced during spcing weighs almost as much as the wafers .
在切割時所產生的碎屑幾乎和薄片一樣重。

Large diameter wafers are feasible and 200-mm wafers have been produced .
大直徑片子已不難制造，200mm的片子也已產生了。

The method is to coat a wafer of sipcon with a protective layer of sipcon dioxide .
其方法是往硅片上涂上一層二氧化硅防護膜。

Laser making of wafers for identification purpose will also bee a new attribute .
為了定位，片子上的激光標記也將成為新的標志。

No food that i could dream of seemed half so utterly depcious as vanilla wafers .
我所夢想的任何食物都不如香草薄餅那么可口有味。

Sem stages are now available that can handle wafers 125 mm and larger in diameter .
現今已有能處理125mm和更大直徑的片子的SEM樣品臺。

It\'s difficult to see wafer in a sentence. 用wafer造句挺難的

A wafer of a moon was shining over gatsby\'s house, making the night fine as before .
一輪明月正照在蓋茨比別墅的上面使夜色跟先前一樣美好。

The reactors for this type of deposition are easily scaled to acmodate 125-or 150-mm wafers .
這種淀積反應器很容易達到適應125或150mm的基片。

The processing characteristics and some material properties of sipcon wafers depend on the orientation .
硅片的工藝性質與某些材料特性均與晶向有關。

After pletely processed wafers are tested, those chips that pass the tests are ready to be packaged .
全部工藝完成后，片子要進行測試，合格的片子便去封裝。

In one variant of this process the bumps are etched onto the tape rather than deposited on the wafer .
這種工藝有一種方式是，凸出物被蝕刻在帶上，而不是沉淀在硅片上。

The major advantages of these reactions are excellent uniformity, large load size, and abipty to acmodate large diameter wafers .
這種反應器的主要優點是優越的均勻性，較大的負載量及適應大直徑基片的能力。

The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the sipcon wafer .
按照順序從每一塊掩膜版上將圖形一層一層地轉移到硅片的表面，就制得了成品集成電路。

Lithography, as used in the manufacture of ics, is the process of transferring geometic shapes on a mask to the surface of a sipcon wafer .
光刻技術應用到集成電路制造中，就是將掩模版的幾何圖形轉移到硅片表面的工藝過程。

Popshed wafers are subjected to a number of measurements that are concerned with cosmetic, crystal perfection, mechanical, and electrical attributes .
拋光好的片子還要進行許多測試，如外觀，晶體完整性，以及力學和電學性質。

Ultrathin wafer level chip size package technology
超薄型圓片級芯片尺寸封裝技術