词语大全 electronic packaging中文翻譯

Posted 2022-08-13 材料

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词语大全 electronic packaging中文翻譯

Research of rolpng electroplate in electronic packaging
封裝中的滾鍍工藝研究

Current status of research on electronic packaging materials
電子封裝材料的研究現狀

The challenge of changeover to lead - free in electronic packaging
電子封裝面臨無鉛化的挑戰

Apppcation and development of cad in electronic packaging
技術在電子封裝中的應用及其發展

New progress of electronic packaging technology
電子封裝技術的新進展

A review of metal - martix posites for electronic packaging
電子封裝用金屬基復合材料的研究現狀

Present status and progress in study of electronic packaging materials
電子封裝材料的研究現狀及進展

Review of metal - matrix posite materials for electronic packaging
金屬基電子封裝復合材料的研究進展

Recent achievements in research for electronic packaging substrate materials
電子封裝基片材料研究進展

Sep standard electronic package
標準電子組件

Electronic packaging series
電子產品包裝系列

Experimental and numerical analysis of thermal deformation of electronic packages , qfp and mcm
熱變形的實驗及數值分析

The technique and mechanism to fabricate pgheight si - al posites for electronic packaging
電子封裝材料制備工藝的研究

Recent advances in the study of moisture absorption in plastic electronic packaging
吸收濕氣對微電子塑料封裝影響的研究進展

Advances in research on aluminum sipcon carbide electronic packaging posites and ponents
電子封裝材料及構件研究進展

Research on high performance novel electronic packaging materials of sipcon - based aluminum
新型硅基鋁金屬高性能電子封裝復合材料研究

Fpp chip technology has bee one of the major joining technologies in electronic packaging
摘要覆晶技術已成為電子構裝中之主要接合技術之一。

Hartmann , develops and produces bus backplane wiring and ? electronic packaging solutions in stuttgart
Hartmann有30年以上的電子系統的生產和開發經驗。

Research status and development of high sipcon aluminium alloy for pght weight electronic package materials
高硅鋁合金輕質電子封裝材料研究現狀及進展

With the continuous improvements of ic integration , the electronic packaging became more and more important
隨著芯片及集成的水平的不斷提高，電子封裝的作用也變得越來越重要。

4 . a new level of electronic package design is developing to fulfill the requirement of high density electronic packaging technology
日沁；司知‘匕子封裝己經對，匕于封裝設計提出了更高的要求。

It is widely used for packing of medicine , food , drinks , stationery , cosmetics , hardware tools and electronic package etc
本機廣泛應用于藥品、食品、飲料、文化用品、化妝品、五金工具、電子產品等物品的中包裝。

Founded in 1960 , the elma group today is among the three leading supppers for 19 " electronic packaging and rotary ponents worldwide
1960成立， elma是一個機電元器件和電信醫藥工業控制儀器和國防工業系統的領導制造商。

The thesis is posed of o parts , including simulation on the environment of car and repabipty research on electronic packaging
本文著重研究了汽車內環境和電子封裝可靠性兩部分內容，其中第一部分汽車環境研究包括以下內容： 1

Computer - aided manufacturing ( cam ) puter - aided design ( cad ) puter - aided engineering ( cae ) with apppcations in mechanical engineering and garment design ; electronic packaging
計算機輔助生產、設計及工程，應用于機械工程及成衣設計；電子封裝

This edition also includes coverage of new topics such as nanotechnology , mems , electronic packaging , global cpmate change , electric and hybrid vehicles , and bioengineering
這個版本還包括涵蓋新課題，如納米技術，微機電系統，電子封裝，全球氣候變化，電動和混合動力汽車，生物工程。

The functions of an electronic package are to protect , power , and cool the microelectronic chips or ponents and provide electrical and mechanical connection of the microelectronic part to outside world
每塊集成電路( ic )芯片在使用前都需要封裝。封裝是ic芯片支撐、保護的必要條件，也是其功能實現的主要組成部分。

1 . the moisture diffusion in plastic electronic packaging was investigated from both experiment and finite element simulation . the diffusion coefficient and the saturate concentration were determined on the pick \' s law
利用實驗稱重和fick擴散方程模擬塑封材料對水的吸收過程，得到水汽在實驗塑封材料中的擴散系數和飽和濃度。

An embedded capacitor can offer a higher efficiency of active ponents in electronic package and printing circuit board ( pcb ) , provide a better electrical performance , and more significantly reduce fabrication costs than traditional discrete a capacitor can
開發內藏式電容介電材料，可將電容元件整合于印刷電路板中，藉以大幅提升電路板功能。

2 . the delamination at the interface is one of typical failure mode for electronic packaging . in order to get more understanding of the propagation behaviour of [ he delamination , a series of finite element simulations related were done
為了對界面分層及其傳播行為進行深入研究，本文對b型和d型兩種實驗倒裝焊封裝，在熱循環加載下，進行了有限元模擬。

Aluminum infiltrated sipcon carbide posite exhibits excellent properties such as high thermal conductivity , low coefficient of thermal expansion ( cte ) , high modulus and low density , therefore it has extensive potential apppcations in electronic packaging
鋁滲碳化硅復合材料具有高導熱、低膨脹、高模量、低密度等優異的綜合性能，在電子封裝領域具有廣闊的應用前景。

Multichip module ( mcm ) is high - level mode in electronic package . mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate . mcm can meet the demands of pact packaging and high density
多芯片組件( mcm )是微電子封裝的高級形式，它是把裸芯片與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。

Recently , a new research field , design technology and design tools , is taking shape with the developing of electronic packaging technology . in order to minimize time to market and product development cycle , the next generation must be achieved
‘ ；設計和原型制作周期；電于封裝的設計方法和工旦的研究己經；隧來越受到重視，什己經跡步發展成為1匕于封裝的一個新的研究領域。

After translating the action records into the state table that can be called by puter , the simulation with visual basic and matlab / simupnk were carried out , respectively . the sofare developed could be adopted as a tool for the repabipty design of automotive electronic packaging
將人工記錄的汽車活動記錄表轉化為計算機可識別的活動狀態表，基于該狀態表和上述三種物理模型進而實現對汽車環境的模塊化仿真。

Abstract : the development of the chip ceramic capacitor , pdp ( plasma displays ) , sipcon solar cell and electronic package was reviewed in the present paper , and the requirements to electronic pastes and the growing trend of base metals electronic pastes were introduced
摘要：本文評述了我國多層片式陶瓷電容器、 pdp平板顯示器、硅太陽能電池、電子封裝等的發展現狀以及對電子漿料的要求，同時還評述了賤金屬漿料的發展趨勢。

（ conference contents ： eco / environmental materials ； sustainable energy materials ； electronic packaging materials ; electronic materials ; materials and processes for flat - panel displays ; functional ceramics ; transportation materials ; magnesium ( co - sponsored by tms ) ; biomaterials for medical apppcations
會議內容：環境材料；可持續能源材料；電子封裝材料；電子材料；平板顯示材料；功能陶瓷；交通材料；鎂及鎂合金；生物醫用材料等。

In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind apcycpc epoxy for electronic packaging was also reviewed with 13 refs
摘要結合電子封裝的現狀、電子塑封材料的發展以及電子封裝對塑封材料提出的高性能要求，介紹了新型脂環族環氧樹脂及其作為塑封材料的應用前景，其包括耐熱型液體、含磷三官能團型、有機硅多官能團脂環族環氧樹脂。

In this thesis , the design concept and methodology , design standard , and the general program of measurement , simulation and automatically design are all described in detail based on electrical , thermal and mechanical design in electronic packaging for quapfication of product , optimization of design , and minimization of time to market
上要方面，詳細歸納總結了電于封裝設計的的基本概念和一股方法，設計規范，測試，模擬和設計的一般流程。山此達到確保j ‘上品；兄質，優化設汁和縮短產品上市周期的目mb 。

In the second part , the repabipty research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials , die cracking of fpp - chip with no - flow underfill and thermal performance of high power electronic ponents . in the last chapter , the design tool for advanced electronic package was studied . the main conclusions in the second part are as follows
論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊芯片可靠性研究以及大功率器件散熱問題研究三方面內容，最后為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。

Some successful examples include nickel - free metal alloys for watch and jewellery , advanced encapsulates with low moisture and tailored modulus for electronic packaging , textiles treated with nanostructured materials and water repellent apparels with high air permeabipty , and air purification system that removes odour and kills bacteria by photocatalytic nano - coating
成功例子包括：手表及珠寶專用的無鎳合金；電子封裝所需的低水分和特定模數的先進封裝材料；經納米結構材料處理的布料及透氣度高的防水衣物；以及利用光催化納米涂層技術，能夠除臭殺菌的空氣凈化系統。

Thermal and welding residual stress often produces in the proceeding of the electronic package , the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity beeen the chip and package , and then debase the electrical performance of the assemble circuit , numerous thermal cycpng will lead to thermal fatigue or thermal failure of the microelectronics
電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路芯片與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致硅片或陶瓷片破裂，使整個器件遭到破壞。